The liquidus temperature of this kind of solder wire is lower than eutectic crystal melting point(138℃)of tin-lead,so it is named low temperature solder wire.It is formed by mix bismuth、indium、cadmium etc. into the alloy of tin-lead. It is often used in heat resistance in default of component assembly such as micro-electronics sensor.
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Shenzhen YuXinTai Solder Co., Ltd.
Factory address:No.1 Fuzhong Industry Park,Xiashiwei,Fuyong town,Baoan District,Shenzhen,China