1.Solder material shouldn¡¯t be splash or excess smoke at little high temperature during lead-free solder.

2.Solder material should have activation compound series which can solder many kinds of lead-free circuitry boards and components.

3.Solder material should have enough activity and keep enough activity when it touch with iron head.

4.If it is No-cleaning solder material,the solder material¡¯s remain must be benign and if solder material is water-solubility,it should be easy cleareded by hot water.

5.When using a little high temperature for iron head,the remain shouldn¡¯t be burn or turn dark.