·relatively low cost

·relatively no harm

·no potential environment matter;grade graduly decline.

·security order:Bi﹥Zn﹥In﹥Sn﹥Cu﹥Ti﹥Ag﹥Pb

·capability of melt humid to commonly lead-free component and circuitry board end adorn material.

·alloy can bring into play action only if it combine existing sealing technology and stipulation.

·can form credibility solder point,no oxide adulterant,dinky sealing crack.

·contain each other with relativity low temperature management.

·re-canker and not easily affacted by electrolytic canker act cause.

·contain with copper group-board，nickel surface with dip-gold coat, many kinds of lead-free group-board, and lead group-board.

·the product forms that alloy must possess contain solder bar,solder wire,pre-molding organ,solder ball and solder paste.

·there must be plenty of metal used in alloy manufacture.

·low melting point(﹤240℃).

·good character oftransmit electricity.