¡¡Along with the increasingly regard of environment protect in nowaday world,and the lead-free manufacture proceeding constantly outcoming from theory to practice in electron industry thereby DIP lead-free maunfacture proceeding was applied more and more widely by every eclectron manufacturers.Yonghan group has developed LF series lead-free aid-solder solvent be right of her 28 years¡¯ experice of research & development and maunufacture,that meet with the clients¡¯ requirement of the flux.

Lead-free flux(LF-1133D-N¡¢LF-1133S-N£© is adopted by European import natural rosin ,composed with the elements that be taken out the impurity and bad material by special chemicalreaction append many kinds ofnice density solder material.It has the characteristics of rapidly dry,solder drop extinctiion and satiety structure,no-causticity,excellent soldering,best ascendency moist soldering and ascendant safety. It¡¯s specialy designed for the high moisture exercise environment in Taiwan .It can reach entirety no-cleaning and accord with all electric¡¯s requirement.If it need to be cleaned just according to general cleaning flow will obtain quite well trust of cleaning.

¡¤LF-1133D-N¡¢LF-1133S-N are fit of£¨FOAMING£©or£¨DIPPING£©exercise which proportion should be desided by group board or the oxidation degree of hardware feets.General the proportion is between 0.810¡«0.830£¨20¡æ£©.The proportion offlux cahnge follow temperature which take the proportion at 20¡æ as standard.We know from experience between£¨15-30¡æ£©when it raises 1¡æ the flux¡¯s propotion declines 0.001.When practice operate may increase and reduce properly according to local task¡¯s temperature insure according the task¡¯s condition.

¡¤Following are the task instances which must be commonly setup rather high proportionnact£º

1¡¢When the group board is oxidated strictness(the phonomenon cann¡¯t impersonality distinguish by naked eye and must be checked by lab)

2¡¢When the hardward end is oxidated strictness

3¡¢When the group board hardward¡¯s density is high

4¡¢When the direction of group board hardward is differ to solder

5¡¢Multiayer board

6¡¢When the solder temperature is quite low

7¡¢When have cleaning technics flow

¡¤Must cautiously check its proportion every 2 hours in daily task,if there is exceed standard should add thinner immediately to renew the proportion which setup before.Contrarily if there is under standard should add original flux renew it and make notes prepared to be checked.

¡¤During solder task,wave crest welding must be a smooth wave crest surface that the solder point will get nicer extinction effect,just like hand dip welding which extinction is especially nice.Moreover if it pass two wave crest,the extinction will beprodigious effected.

¡¤Fit of high-speed or low-speed in solder task,but must first check tin liquid and group board condition then deside the task¡¯s speed.Suggest the task¡¯s speed best keep 3-5 seconds.For exert best speed of solder condition,if it still can¡¯t be well sealed exceed 6 seconds which is likely to other basal material or task condition need to be adjust,had better to look after multuality manufacturers to assist solve.

¡¤The warm-up equipment on solder machine must keep the temperature of group board solder surface between 80-120¡æ so that it can bring into it¡¯s best play.

¡¤Can be used for twice task,first solder must adopt low proportion to the best of avoiding damaging group board and hardware that work the oxidation of solder porit because of twice high temperature.

¡¤Please overhaul termly the air pressure in the air-press machine when adopt the froth mode and may as well can prepare more than two pathes strain water machine to avoid the hydrosphere into flux so that affect the it¡¯s structure and capability.

¡¤The minuteness of foam grainthe best when froth,must notice at any moment whether the foam grain¡¯s size are equality or not,whereas,it must be blocked in the froth tube,leaking gas or trouble.The height offroth that no exceed group board hardware¡¯s surface is the fittest in principle.When nonuseing the flux in forth groove,must cover it to avoid volatilization and be polluted with hydrosphere or put it into a clean vessel.Mustn¡¯t let the flux froth haven¡¯t pass group board so letdown all kinds of pollution.

¡¤The flux must be all let out and change new fluid after being used for 50 hours in order to prevent pollution,aging decay affacts the task¡¯s effection and quality.

¡¤No using optionally the thinner of append other company or other brand¡¯s fluxfactory in order to prevent the breaking of chemical structure and lead to the aftereffect that can¡¯t be tidied.

¡¤During the task,the nakedness board and hardware end must prevent to be polluted by the sweatand hands¡¯remain,grease or other material.Please keep cleaning and no using hands to pollute when the group board hasn¡¯t dry complely after soldering.